Corintech Boosts Capability with Vapour Phase Reflow Oven
Corintech is pleased to announce our latest investment in high-quality UK PCB assembly services with the installation of a state-of-the-art vapour phase reflow oven, complementing our existing zoned reflow options.
Vapour phase reflow technology utilises an inert fluid’s vapour to achieve heat transfer during the soldering process. This method offers precise temperature control and uniform heat distribution, reducing the likelihood of thermal shock to sensitive electronic components. Unlike conventional reflow ovens that heat boards in zones, vapour phase reflow maintains an even temperature, set at the boiling point of the fluid used, ensuring all parts of the board reach the same temperature simultaneously.
Additionally, the risk of overheating is virtually eliminated with vapour phase reflow. The temperature in the chamber cannot exceed the boiling point of the fluid, making it impossible to overheat components, unlike zoned ovens where thermal gradients can lead to uneven heating. This feature is particularly beneficial for manufacturing complex, high-density electronic assemblies where even minor temperature variations can compromise the integrity of the circuitry. Vapour phase reflow enables more reliable soldering for certain types of component packages, particularly those that are sensitive to heat and require uniform temperature distribution during the soldering process including BGAs, QFNs and other fine-pitch or high-density components.
This new reflow oven also contributes to enhanced soldering quality with its superior oxide reduction capability. The vapour blanket created in the chamber significantly reduces oxidation during soldering, which improves the wetting properties of the solder and results in stronger, more reliable joints.
Another benefit of this technology is its excellent thermal efficiency.
"The vapour phase reflow oven allows us to achieve nearly 100% heat transfer efficiency, which is a significant improvement over the 40-50% efficiency of traditional reflow systems, this efficiency reduces energy consumption, aligning with Corintech’s sustainability goals."
Despite the higher initial cost of vapour phase reflow ovens compared to traditional options, the benefits they bring to electronics manufacturing are indisputable. Improved thermal efficiency, reduced risk of component damage, and enhanced solder joint quality all contribute to lower defect rates and reduced rework costs, ultimately improving the quality and reliability of electronic assemblies.
As the electronics industry continues to evolve with increasingly complex and sensitive components, the adoption of vapour phase reflow technology represents a forward-thinking approach to addressing the challenges of modern electronics manufacturing. With this latest installation, Corintech is set to not only boost operational efficiency but also set new standards in the quality of electronic products.
Interested in exploring whether this technology could add to your product quality and reliability? Get in contact with a member of the Corintech team today.
