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Wire Bonding

Achieve Electronics Manufacturing Excellence with Corintech

ELECTRONICS MANUFACTURING

Bare Die Wire Bonding

Wire bonding is used to electrically interconnect an integrated circuit, or any other semiconductor device, to a compatible metallic surface. A length of small-diameter, soft metal wire is used to make the link, and the bond is created by applying force and ultrasonic vibration. Finished circuits are normally protected with epoxy encapsulation.

Chip-on-board wire bonding is a core part of Corintech’s assembly capabilities, with gold and aluminium wire bonding machines available in the Far East. These give us the capability to work with wire diameters as low as 15 microns for aluminium wire and 25 microns for gold wire.

Wire bond process

Ball Bonding

Using our ASM Automatic Wire Ball Bonder, we are able to provide ball bonding solutions for a variety of substrates. Ball bonding techniques allow for the production of more complex wire loops, potentially improving your design efficiency. This machinery’s advanced features and intelligent interface facilitates precision fine pitch bonding with rapid turnaround.

  • Higher numbers of inputs and outputs
  • Reduced costs from smaller size (less materials required)
  • Smaller and lighter final product
  • Increased wafer output
  • Potentially improved electrical performance
Contact our team today if you want to discuss potential wire bonding enhancements for your product design, or you want your electronics manufacturing carried out to a higher level of quality.
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Call us now on +44 (0)1425 655655. Our experienced team are on hand to discuss your requirements and provide expert advice.

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Latest News from Corintech

Corintech to Exhibit at Southern Manufacturing & Electronics 2025

December 10, 2024

We’re excited to announce that Corintech will once again be exhibiting at Southern Manufacturing & Electronics 2025, one of the UK’s premier events for engineering and manufacturing innovation. From 4th to 6th February 2025 at the Farnborough International Exhibition and Conference Centre. You’ll find us at Stand D165, where our expert team will be showcasing the capabilities that have established Corintech as a leader in electronic design and manufacturing. What To Expect at Our Stand Visitors can explore a diverse range of our specialised services and products, including: High-Quality PCB Assembly: Discover our fast turnaround printed circuit board assembly services, where efficiency meets the highest standards of precision and quality.

Enhancing Manufacturing Quality: Corintech Introduces CompaClean II PCB Cleaner

September 5, 2024

In the highly technical field of electronics, ensuring the quality and reliability of printed circuit board assemblies (PCBAs) is crucial. Recognising this, Corintech has made a significant move to enhance its production standards by installing the new PBT Works CompaClean II PCB cleaning machine. This investment highlights the importance of washing PCBAs and demonstrates Corintech’s ongoing commitment to achieving quality assurance.   The Importance of PCB Cleaning:   Contaminant Removal: During assembly, PCBAs can become contaminated with flux, solder paste and other residues. If not cleaned, these pollutants may cause corrosion and electrical problems. Corintech’s CompaClean II machinery effectively removes these contaminants, ensuring the integrity of each assembly.   Avoidance of Electrical Failures:

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Corintech Ltd

  • Ashford Mill
  • Station Road
  • Fordingbridge
  • Hampshire
  • SP6 1DZ
  • UK
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