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Thick Film Hybrid Circuit Boards

Achieve Electronics Manufacturing Excellence with Corintech

ELECTRONICS MANUFACTURING

Thick Film Hybrid Specialists

Corintech has been a leading specialist in the design and manufacture of thick film circuit board microelectronic assemblies since 1977.

What Are Thick Film Circuit Boards?

Thick film hybrid circuits are made using a print & fire (P+F) technique. This involves a combination of multi-layer screen printing of precious and semi-precious metals (Au, Ag, Pd), as well as the firing of tracks and precision resistors onto a range of ceramic and metal substrates. Surface mount components and bare die components with wire bonding can also be incorporated, and optional full encapsulation provides greater environmental protection. The use of different pastes allows the production of conductive tracks as well as resistors, which can be custom specified and then laser-trimmed to a high level of accuracy, offering an exact choice of value so that no compromise in design is necessary.
Corintech Hybrid

What Are Thick Film Hybrids Used For?

Thick Film Hybrids are ideal for environments where a high level of reliability is needed as they can withstand a much wider temperature range and have higher durability than conventional PCB assemblies.

Thick Film technology is used extensively in aerospace, defence and automotive applications. However, its durable and reliable nature is starting to appeal to a broader market. As an experienced company in this technology, we are the perfect partner to develop and manufacture thick film circuit boards to suit any application.

What Are The Benefits Of Thick Film Hybrids?

Ceramic substrates provide a number of key advantages over standard FR4 based PCBs. One of the primary advantages is their thermal conductivity. For example, Aluminium Oxide (Alumina) offers an increase in thermal conductivity of approximately 20 times that of FR4, and Aluminium Nitride offers an increase of approximately 100 times.

Another advantage of ceramic substrates is that they offer extremely low thermal expansion properties. This makes them ideal for use in harsh environments where extremes of temperature are likely. The combination of low thermal expansion and high thermal conductivity ensures that not only is thermal expansion limited, but it is also evenly spread across the board, limiting the possibility that large amounts of stress will be exerted in specific areas.

Key Benefits:

  • High reliability for harsh environments
  • Flexibility to choose precise resistor values with active laser trimming
  • High voltage resistors
  • Extended temperature range performance
  • Improved thermal management
  • Excellent high-frequency performance
  • Low start-up costs
  • Fast lead time to prototype
Hybrid Staged Process

What Substrates Can Be Used?

At Corintech, we are able to print circuits on the following substrates:

  • ADS-96R
  • ADS-996R
  • ADOS-90R
  • All Alumina
  • Aluminium Nitride
  • Quartz Substrates
  • Stainless Steel

Each substrate possesses unique properties, making them suitable for specific purposes. Contact our design team to discuss how you can best utilise thick film technology in your designs.

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Call us now on +44 (0)1425 655655. Our experienced team are on hand to discuss your requirements and provide expert advice.

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Latest News from Corintech

Corintech to Exhibit at Southern Manufacturing & Electronics 2025

December 10, 2024

We’re excited to announce that Corintech will once again be exhibiting at Southern Manufacturing & Electronics 2025, one of the UK’s premier events for engineering and manufacturing innovation. From 4th to 6th February 2025 at the Farnborough International Exhibition and Conference Centre. You’ll find us at Stand D165, where our expert team will be showcasing the capabilities that have established Corintech as a leader in electronic design and manufacturing. What To Expect at Our Stand Visitors can explore a diverse range of our specialised services and products, including: High-Quality PCB Assembly: Discover our fast turnaround printed circuit board assembly services, where efficiency meets the highest standards of precision and quality.

Enhancing Manufacturing Quality: Corintech Introduces CompaClean II PCB Cleaner

September 5, 2024

In the highly technical field of electronics, ensuring the quality and reliability of printed circuit board assemblies (PCBAs) is crucial. Recognising this, Corintech has made a significant move to enhance its production standards by installing the new PBT Works CompaClean II PCB cleaning machine. This investment highlights the importance of washing PCBAs and demonstrates Corintech’s ongoing commitment to achieving quality assurance.   The Importance of PCB Cleaning:   Contaminant Removal: During assembly, PCBAs can become contaminated with flux, solder paste and other residues. If not cleaned, these pollutants may cause corrosion and electrical problems. Corintech’s CompaClean II machinery effectively removes these contaminants, ensuring the integrity of each assembly.   Avoidance of Electrical Failures:

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Corintech Ltd

  • Ashford Mill
  • Station Road
  • Fordingbridge
  • Hampshire
  • SP6 1DZ
  • UK
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